SEMICONDUCTOR DEVICE INCLUDING EMBEDDED MEMORY DIES AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE INCLUDING EMBEDDED MEMORY DIES AND METHOD OF MAKING SAME

A semiconductor device includes a signal carrier medium such as a PCB substrate having first and second opposed surfaces and a cavity formed in the second surface. A first set of one or more semiconductor dies are mounted on the first surface, and a second set of one or more semiconductor dies are m...

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Bibliographische Detailangaben
Hauptverfasser: Gill, Paramjeet, Bock, Kim Lee, Teng, Wei Chiat, Yu, Lee Kong, Chin, Yoong Tatt, Tan, Chong Un
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Beschreibung
Zusammenfassung:A semiconductor device includes a signal carrier medium such as a PCB substrate having first and second opposed surfaces and a cavity formed in the second surface. A first set of one or more semiconductor dies are mounted on the first surface, and a second set of one or more semiconductor dies are mounted within the cavity. The first and/or second sets of semiconductor dies may be memory dies.