NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a base substrate. The base substrate may have a plurality of through substrate vias. In an embodiment, a first die is over the base substrate....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RAORANE, Digvijay, MALLIK, Debendra, SHARAN, Sujit, MAHAJAN, Ravindranath
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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