NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a base substrate. The base substrate may have a plurality of through substrate vias. In an embodiment, a first die is over the base substrate....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RAORANE, Digvijay, MALLIK, Debendra, SHARAN, Sujit, MAHAJAN, Ravindranath
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a base substrate. The base substrate may have a plurality of through substrate vias. In an embodiment, a first die is over the base substrate. In an embodiment a first cavity is disposed into the base substrate. In an embodiment, the first cavity is at least partially within a footprint of the first die. In an embodiment, a first component is in the first cavity.