HEAT PIPE FOR VERTICALLY STACKED FIELD EFFECT TRANSISTORS

HEAT PIPE FOR VERTICALLY STACKED FIELD EFFECT TRANSISTORS

A heat pipe is provided as an electrically inactive structure to dissipate heat that is generated by vertically stacked field effect transistors (FETs). The heat pipe is present in an electrically inactive device area which is located adjacent to an electrically active device area that includes the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Anderson, Brent A, Hook, Terence, Chou, Anthony I
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A heat pipe is provided as an electrically inactive structure to dissipate heat that is generated by vertically stacked field effect transistors (FETs). The heat pipe is present in an electrically inactive device area which is located adjacent to an electrically active device area that includes the vertically stacked FETs. The heat pipe includes at least one vertical interconnect structure that continuously extends between each tier of the vertically stacked FETs