EQUIPMENT AND PROCESS TECHNOLOGIES FOR CATALYST INFLUENCED CHEMICAL ETCHING

EQUIPMENT AND PROCESS TECHNOLOGIES FOR CATALYST INFLUENCED CHEMICAL ETCHING

A method and system for etching a semiconductor substrate using catalyst influenced chemical etching. A group of independently controlled discrete actuators are configured to control a depth of an etch of a material on a substrate, where at least two of the group of independently controlled discrete...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Mallavarapu, Akhila, Sreenivasan, Sidlgata V, Ajay, Paras
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method and system for etching a semiconductor substrate using catalyst influenced chemical etching. A group of independently controlled discrete actuators are configured to control a depth of an etch of a material on a substrate, where at least two of the group of independently controlled discrete actuators has distinct actuation values. Furthermore, the etch depth has a variation of less than 10% of a feature height across the substrate.