METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS SUCH SEMICONDUCTOR PACKAGE ASSEMBLY

A method for manufacturing a semiconductor package assembly is provided. The assembly includes a semiconductor package and a molding resin case encapsulating the semiconductor package. The complete semiconductor package undergoes a surface roughening treatment, thus improving the overall adhesion wi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Lee, Wai Wai, Ting, Jia Yunn, Chang, Ting Wei, Tan, Wei Leong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for manufacturing a semiconductor package assembly is provided. The assembly includes a semiconductor package and a molding resin case encapsulating the semiconductor package. The complete semiconductor package undergoes a surface roughening treatment, thus improving the overall adhesion with the molding resin (EMC) and reducing the risks of delamination.