SUBSTRATE HOLDER, SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND RECORDING MEDIUM

There is provided a technique including: a substrate support including a plurality of first props capable of supporting a plurality of substrates at intervals in an up-down direction; and a partition support including a plurality of partitions and a plurality of second props, the plurality of partit...

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Bibliographische Detailangaben
Hauptverfasser:	OKAJIMA, Yusaku, YAMAGUCHI, Takatomo
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	There is provided a technique including: a substrate support including a plurality of first props capable of supporting a plurality of substrates at intervals in an up-down direction; and a partition support including a plurality of partitions and a plurality of second props, the plurality of partitions each having a cut-away portion at which the plurality of first props is disposed, the plurality of partitions being disposed one-to-one in spaces between the plurality of substrates held by the substrate support, the plurality of second props supporting the plurality of partitions.