EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED RESIN MOLDED BODY, AND INTEGRATED PRODUCT

An epoxy resin composition is provided that is resistant to decomposition at high temperatures and a fiber-reinforced resin molding is provided that hardly suffers significant damage while being welded to another member even in the case where it is combined with a thermoplastic resin layer having a...

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Bibliographische Detailangaben
Hauptverfasser:	Misumi, Jun, Honma, Masato, Shinohara, Kyoko
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	An epoxy resin composition is provided that is resistant to decomposition at high temperatures and a fiber-reinforced resin molding is provided that hardly suffers significant damage while being welded to another member even in the case where it is combined with a thermoplastic resin layer having a high melting point that works as an adhesive layer, as well as a prepreg that serves as a precursor therefor, where the epoxy resin composition includes an epoxy resin (A) that has a polycyclic aromatic hydrocarbon skeleton or a biphenyl skeleton and that has an epoxy equivalent weight of 220 g/eq or more and 290 g/eq or less and a polyamine compound having an average active hydrogen equivalent weight of 55 g/eq or more and 100 g/eq or less wherein the average epoxy equivalent weight over all epoxy resins contained is 160 g/eq or more and 255 g/eq or less.