Thermoelectric Cooling Modules

Various embodiments disclosed herein describe thermoelectric cooling modules. The thermoelectric cooling modules may include a first substrate positioned over a second substrate in a vertical stacking direction, and may include a thermoelectric connector that thermally connects the first and second...

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Bibliographische Detailangaben
1. Verfasser:	Kangas, Miikka M
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING WEAPONS
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Beschreibung
Zusammenfassung:	Various embodiments disclosed herein describe thermoelectric cooling modules. The thermoelectric cooling modules may include a first substrate positioned over a second substrate in a vertical stacking direction, and may include a thermoelectric connector that thermally connects the first and second substrates. The thermoelectric connector may be configured to transfer heat laterally relative to the vertical stacking direction to provide more efficient heat transfer between the first substrate and the second substrate.