CUTTING TOOL

A cutting tool includes a substrate and a hard layer, whereinthe hard layer includes a first unit layer and a second unit layer being alternately layered in the hard layer,a thickness of the first unit layer is 2 to 100 nm,a thickness of the second unit layer is 2 to 100 nm,the first unit layer is c...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI, Yuta, FUKAE, Kosuke
Format:	Patent
Sprache:	eng
Schlagworte:	BORING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TURNING
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Beschreibung
Zusammenfassung:	A cutting tool includes a substrate and a hard layer, whereinthe hard layer includes a first unit layer and a second unit layer being alternately layered in the hard layer,a thickness of the first unit layer is 2 to 100 nm,a thickness of the second unit layer is 2 to 100 nm,the first unit layer is composed of TiaAlbBcN,the second unit layer is composed TidAleBfN,an atomic ratio a satisfy 0.25≤a