CHIP SCALE QFN PLASTIC PACKAGING SYSTEM FOR HIGH FREQUENCY INTEGRATED CIRCUITS

CHIP SCALE QFN PLASTIC PACKAGING SYSTEM FOR HIGH FREQUENCY INTEGRATED CIRCUITS

A Chip-Scale QFN (Chip Scale QFN, CSQFN) plastic packaging system is provided and is for high frequency integrated circuits with high electrical and thermal performance, that does not use connecting wires, which are inexpensive and reliable, whose connection to PCB can be reprocessed and that are co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AKTUG, Ahmet, AYDOGAN, Yigit, DEGIRMENCI, Ahmet
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A Chip-Scale QFN (Chip Scale QFN, CSQFN) plastic packaging system is provided and is for high frequency integrated circuits with high electrical and thermal performance, that does not use connecting wires, which are inexpensive and reliable, whose connection to PCB can be reprocessed and that are compatible with standard SMD bonding processes on PCB.