TRANSISTOR PACKAGE CONSTRUCTION

TRANSISTOR PACKAGE CONSTRUCTION

Embodiments of a transistor package construction is disclosed, including: a transistor comprising: a source; and a drain; and a package comprising: a metallic back surface that is electrically connected to the drain; a top surface comprising a notch; and a thermally conductive and electrically insul...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Ingalz, Charles, Yang, Bozhi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments of a transistor package construction is disclosed, including: a transistor comprising: a source; and a drain; and a package comprising: a metallic back surface that is electrically connected to the drain; a top surface comprising a notch; and a thermally conductive and electrically insulating layer covering at least a portion of the metallic back surface of the package.