FILM ADHESIVE AND METHOD FOR MAKING SAME; DICING/DIE BONDING INTEGRATED FILM AND METHOD FOR MAKING SAME; AND SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME

The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor chip mounted thereon; and a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AKIYAMA, Yuya, TANIGUCHI, Kohei, HIRAMOTO, Yuya, ITAGAKI, Kei, KAMONO, Megumi
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor chip mounted thereon; and a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member. The bonding adhesive member includes a sintered body of silver particles.