A DEVICE AND A METHOD OF MANUFACTURING A DEVICE, SUCH AS A LIQUID LENS, WITH BOND CONFIGURED TO FRACTURE AT THE SAME BURST PRESSURE

A device comprising: a first substrate; and a second substrate bonded to the first substrate via an innermost bond, an outermost bond, and bonds between the innermost bond and the outermost bond, the second substrate comprising a through-hole and an axis extending through the through-hole. Each of t...

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Bibliographische Detailangaben
Hauptverfasser:	Chen, Naigeng, Luo, Weiwei, Quesada, Mark Alejandro, Yang, Bo, Logunov, Stephan Lvovich
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A device comprising: a first substrate; and a second substrate bonded to the first substrate via an innermost bond, an outermost bond, and bonds between the innermost bond and the outermost bond, the second substrate comprising a through-hole and an axis extending through the through-hole. Each of the bonds has a strength, and the strength of the bonds increases sequentially from the innermost bond to the outermost bond. The strength of each bond is sufficiently low such that the bonds fail in response to liquid (within a cavity defined by the first substrate, a third substrate, and the through-hole of the second substrate) exerting pressure on the first substrate instead of the first substrate failing. Each of the bonds are configured to fail at approximately the same pressure exerted upon the first substrate by the liquid. Additionally disclosed is a method of manufacturing the device.