CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT

An object is to provide a cured product superior in heat resistance (high glass transition temperature) and dielectric properties (low dielectric properties) by using a curable resin having a specific structure and superior in storage stability. Specifically, a curable resin represented by general f...

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Bibliographische Detailangaben
Hauptverfasser: MATSUOKA, Ryuichi, YANG, Lichen, KANNARI, Hiroyoshi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An object is to provide a cured product superior in heat resistance (high glass transition temperature) and dielectric properties (low dielectric properties) by using a curable resin having a specific structure and superior in storage stability. Specifically, a curable resin represented by general formula (1) below and having a hydroxyl group concentration of 0.005 to 3800 mmol/kg is provided.