PLATING FILM AND PLATING FILM PRODUCTION METHOD

The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.

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Bibliographische Detailangaben
Hauptverfasser: Nagao, Toshimitsu, Shimada, Kazuya, Sakata, Toshihiko, Hayamizu, Masahito, Katayama, Junichi, Tsukuda, Mayu, Fuku, Shuhei, Hirooka, Asuka
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.