MEMS MICROPHONE PACKAGE

A MEMS microphone package is provided. The MEMS microphone package includes a substrate and a circuit device, the substrate has a conductive structure, and the circuit device has through silicon via structures that are electrically connected to the conductive structure. The MEMS microphone package a...

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Bibliographische Detailangaben
Hauptverfasser:	CHEN, Iou-Din Jean, WANG, Shih-Chung, CHEN, Yung-Wei, HUANG, Yen-Son Paul
Format:	Patent
Sprache:	eng
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	A MEMS microphone package is provided. The MEMS microphone package includes a substrate and a circuit device, the substrate has a conductive structure, and the circuit device has through silicon via structures that are electrically connected to the conductive structure. The MEMS microphone package also includes a sensor disposed on the substrate and having a connecting structure disposed on the bottom of the sensor. The connecting structure is electrically connected to the substrate and the circuit device. The MEMS microphone package further includes a cap covering the circuit device and the sensor and separated from the circuit device and the sensor.