SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

A semiconductor package is provided. The semiconductor package includes a substrate; a plurality of first semiconductor chips on the substrate and spaced apart from each other in a first direction; a plurality of second semiconductor chips on the plurality of first semiconductor chips; a spacer betw...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HWANG, Won Hee
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor package is provided. The semiconductor package includes a substrate; a plurality of first semiconductor chips on the substrate and spaced apart from each other in a first direction; a plurality of second semiconductor chips on the plurality of first semiconductor chips; a spacer between an uppermost one of the plurality of first semiconductor chips and a lowermost one of the plurality of second semiconductor chips, a plurality of trenches extending in the first direction; and a mold layer within the plurality of trenches.