SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

According to one embodiment of the present disclosure, there is provided a technique that includes: a load lock chamber into which a substrate is loaded and from which the substrate is unloaded; a substrate support provided in the load lock chamber and configured to support a plurality of substrates...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HARA, Naoki, OKAZAKI, Taiyo, HIYAMA, Shin
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:According to one embodiment of the present disclosure, there is provided a technique that includes: a load lock chamber into which a substrate is loaded and from which the substrate is unloaded; a substrate support provided in the load lock chamber and configured to support a plurality of substrates comprising the substrate in a multistage manner with a predetermined interval therebetween; and a temperature sensor capable of measuring a temperature of the substrate support in a non-contact manner while the plurality of substrates are supported by the substrate support.