SUBSTRATE TREATMENT APPARATUS

The present disclosure relates to a substrate treatment apparatus comprising: a process chamber; a first electrode positioned in the upper part of the process chamber; a second electrode positioned below the first electrode and including a plurality of openings; a plurality of protruding electrodes...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JEON, Bu Il, JANG, Dae Soo, SA, Seung Youb, LEE, Ji Hun
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present disclosure relates to a substrate treatment apparatus comprising: a process chamber; a first electrode positioned in the upper part of the process chamber; a second electrode positioned below the first electrode and including a plurality of openings; a plurality of protruding electrodes extending from the first electrode to the plurality of openings of the second electrode; and a substrate support part facing the second electrode and supporting a substrate.