HEAT PUMP
A heat pump includes a refrigerant circuit for a refrigerant, a refrigerant collector belonging to the refrigerant circuit and through which the refrigerant flows, an expansion device through which the refrigerant flows and connected downstream of the refrigerant collector as seen in the flow direct...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A heat pump includes a refrigerant circuit for a refrigerant, a refrigerant collector belonging to the refrigerant circuit and through which the refrigerant flows, an expansion device through which the refrigerant flows and connected downstream of the refrigerant collector as seen in the flow direction of the refrigerant, an evaporator belonging to the refrigerant circuit and through which the refrigerant flows and connected downstream of the expansion device as seen in the flow direction of the refrigerant, and a condensate pan that is assigned to the evaporator and is designed to catch condensate forming on the evaporator. The refrigerant collector is designed to be connected in a thermally conductive manner to the condensate pan. In order for heat present externally at the refrigerant collector to be transferred by thermal conduction to the condensate pan, a distance between the refrigerant collector and the condensate pan is at most 15 cm. |
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