CUTTING APPARATUS

A cutting apparatus includes a cutting liquid supply nozzle that is disposed adjacent to a cutting unit and supplies a cutting liquid to a contact point between a cutting blade and a workpiece and a chemical liquid supply nozzle that has a length in a Y-axis direction which is greater than the width...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: TAKENOUCHI, Kenji
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A cutting apparatus includes a cutting liquid supply nozzle that is disposed adjacent to a cutting unit and supplies a cutting liquid to a contact point between a cutting blade and a workpiece and a chemical liquid supply nozzle that has a length in a Y-axis direction which is greater than the width of the workpiece and supplies a chemical liquid for preventing adhesion of cutting swarf to a front surface of the workpiece.