SOLDERING APPARATUS AND SOLDERING SYSTEM, AND PROCESSING APPARATUS

A soldering apparatus that applies a processing light for melting a solder disposed on a circuit board, includes: a light irradiation apparatus that includes a Galvano mirror and that applies the processing light through the Galvano mirror; a detection apparatus that detects a light from the circuit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MIYAKAWA, Tomoki, SHIMIZU, Hayate, HIRATA, Junya, MIMURA, Kohei, SATO, Shinji, HOSOMI, Koji, HASEGAWA, Satoshi
Format:	Patent
Sprache:	eng
Schlagworte:	CHAMBERS PROVIDED WITH MANIPULATION DEVICES CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING HAND TOOLS MACHINE TOOLS MANIPULATORS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A soldering apparatus that applies a processing light for melting a solder disposed on a circuit board, includes: a light irradiation apparatus that includes a Galvano mirror and that applies the processing light through the Galvano mirror; a detection apparatus that detects a light from the circuit board and that generates at least one of image data and shape data; a robot arm that is provided with the light irradiation apparatus and the detection apparatus and that includes a driver that moves the light irradiation apparatus and the detection apparatus; and a control apparatus that controls a direction of the Galvano mirror such that the processing light from the light irradiation apparatus that is displaced with the detection apparatus is applied to a same position, on the basis of at least one of the data that are changed in accordance with a displacement of the detection apparatus.