METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

To manufacture a semiconductor device, a first heat treatment for curing a first adhesive material of a conductive paste type is performed, after a semiconductor chip is mounted on a die pad of a lead frame via the first adhesive material. After that, a metal plate is disposed on a pad of the semico...

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Bibliographische Detailangaben
Hauptverfasser: KITAICHI, Kosuke, SUGIURA, Masatoshi, MAEDA, Takehiko, TAKADA, Keita, TAMIMOTO, Hideaki, KYOUGOKU, Yoshitaka
Format: Patent
Sprache:eng
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Zusammenfassung:To manufacture a semiconductor device, a first heat treatment for curing a first adhesive material of a conductive paste type is performed, after a semiconductor chip is mounted on a die pad of a lead frame via the first adhesive material. After that, a metal plate is disposed on a pad of the semiconductor chip such that the metal plate faces the pad of the semiconductor chip via a second adhesive material of a conductive paste type, and a second heat treatment is performed for curing each of the first adhesive material and the second adhesive material. A time of the first heat treatment is less than a time of the second heat treatment. After the first adhesive material is cured by the first heat treatment, the first adhesive material is further cured by the second heat treatment.