ELECTRONIC DEVICE MODULE AND A DEVICE MODULE BOTH HAVING AN ADHESION PROMOTER LAYER
An electronic device module includes: a core layer having an opening; an electronic device disposed in the opening, one or both of the core layer and the electronic device being at least partially covered by an adhesion promoter layer; and an encapsulant layer at least partially embedding the core l...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | An electronic device module includes: a core layer having an opening; an electronic device disposed in the opening, one or both of the core layer and the electronic device being at least partially covered by an adhesion promoter layer; and an encapsulant layer at least partially embedding the core layer and the electronic device. |
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