ELECTRONIC DEVICE MODULE AND A DEVICE MODULE BOTH HAVING AN ADHESION PROMOTER LAYER

An electronic device module includes: a core layer having an opening; an electronic device disposed in the opening, one or both of the core layer and the electronic device being at least partially covered by an adhesion promoter layer; and an encapsulant layer at least partially embedding the core l...

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Bibliographische Detailangaben
Hauptverfasser: Schmoelzer, Bernd, Fürgut, Edward, Sax, Harry
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An electronic device module includes: a core layer having an opening; an electronic device disposed in the opening, one or both of the core layer and the electronic device being at least partially covered by an adhesion promoter layer; and an encapsulant layer at least partially embedding the core layer and the electronic device.