PHOTOSENSITIVE RESIN MULTILAYER BODY

The present disclosure provides a photosensitive resin multilayer body which comprises a support film and a photosensitive resin layer that is superposed on the support film. The photosensitive resin layer contains from 30% by mass to 70% by mass of an alkali-soluble polymer, from 20% by mass to 50%...

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Bibliographische Detailangaben
Hauptverfasser:	KOSAKA, Junya, KUNIMATSU, Shinichi
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The present disclosure provides a photosensitive resin multilayer body which comprises a support film and a photosensitive resin layer that is superposed on the support film. The photosensitive resin layer contains from 30% by mass to 70% by mass of an alkali-soluble polymer, from 20% by mass to 50% by mass of a compound that has an ethylenically unsaturated double bond, and from 0.01% by mass to 20% by mass of a photopolymerization initiator. The alkali-soluble polymer has an acid equivalent weight of 350 or more, while containing, as a copolymerization component, a (meth)acrylate that has an aromatic group. The compound that has an ethylenically unsaturated double bond contains from 50% by mass to 100% by mass of an acrylate monomer based on the total mass of the compound, while having a double-bond equivalent weight of 150 or more. The photosensitive resin layer has a thickness of 30 μm or more.