PHYSICALLY-INFORMED MULTI-SYSTEM HARDWARE OPERATING WINDOWS

Embodiments disclosed herein include a method for use with a semiconductor processing tool. In an embodiment, the method comprises configuring the semiconductor processing tool, running a benchmark test on the semiconductor processing tool, providing hardware operating window (HOW) analytics, genera...

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Bibliographische Detailangaben
Hauptverfasser: Jang, Mi Hyun, Hong, Jeong Jin, Bhatia, Sidharth, Ummethala, Upendra, Maher, Joshua, Cheon, Sejune
Format: Patent
Sprache:eng
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Zusammenfassung:Embodiments disclosed herein include a method for use with a semiconductor processing tool. In an embodiment, the method comprises configuring the semiconductor processing tool, running a benchmark test on the semiconductor processing tool, providing hardware operating window (HOW) analytics, generating a design of experiment (DoE) using the HOW analytics, implementing process optimization, and releasing an iteration of the process recipe. In an embodiment, the method further comprises margin testing the iteration of the process recipe.