METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE, SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE MANUFACTURED THEREBY, AND DISPLAY DEVICE COMPRISING SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE, SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE MANUFACTURED THEREBY, AND DISPLAY DEVICE COMPRISING SAME

Embodiments relate to a method for manufacturing a semiconductor light emitting device package, a semiconductor light emitting device package manufactured by the method, and a display device including the same. The semiconductor light emitting device package according to the embodiment can include a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: PARK, Joodo, SONG, Hooyoung, CHOI, Myungshin
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments relate to a method for manufacturing a semiconductor light emitting device package, a semiconductor light emitting device package manufactured by the method, and a display device including the same. The semiconductor light emitting device package according to the embodiment can include a first semiconductor layer on a growth substrate, a tether layer on the first semiconductor layer, a light emitting structure on the tether layer, a light-transmitting electrode layer on the light-emitting structure, and a post structure on the light-transmitting electrode layer.