ELECTRONIC PACKAGE

ELECTRONIC PACKAGE

An electronic package includes an electronic structure, a first circuit pattern structure, a plurality of first solders and an encapsulant. The electronic structure includes an electronic device, and has a top surface and a bottom surface opposite to the top surface. The first circuit pattern struct...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HO, Cheng-Lin
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic package includes an electronic structure, a first circuit pattern structure, a plurality of first solders and an encapsulant. The electronic structure includes an electronic device, and has a top surface and a bottom surface opposite to the top surface. The first circuit pattern structure is disposed over the top surface of the electronic structure. The first solders are disposed on the bottom surface of the electronic structure. The encapsulant encapsulates the electronic structure. At least a portion of the encapsulant is disposed between at least two of the plurality of first solders.