MACROCHIP WITH INTERCONNECT STACK FOR POWER DELIVERY AND SIGNAL ROUTING

A device may include a host substrate with two or more circuit regions, one or more first stacks electrically connected to the circuit regions, and one or more second stacks providing electrical connections between the circuit regions. At least some of the second stacks may include an insulator wafer bonded to a die, where the die is bonded to at least one of the circuit regions. At least one of the second stacks may include a power distribution pathway to provide the electrical power to at least one of the circuit regions, which may include includes electrically-conductive vias through the insulator wafer and the die or capacitors in the die. Further, the die of at least one of the one or more second stacks may include electrical pathways to provide electrical connections between at least two of the two or more circuit regions.