MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE

A micro-electro-mechanical system (MEMS) microphone package is provided. The MEMS microphone package includes a first micro-electro-mechanical system (MEMS) sensor die, an integrated circuit (IC) die and a first conductive lid. The first micro-electro-mechanical system (MEMS) sensor die has a first...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN, Iou-Din Jean, WANG, Shih-Chung, CHEN, Yung-Wei, HUANG, Yen-Son Paul
Format: Patent
Sprache:eng
Schlagworte:
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PUBLIC ADDRESS SYSTEMS
TRANSPORTING
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Beschreibung
Zusammenfassung:A micro-electro-mechanical system (MEMS) microphone package is provided. The MEMS microphone package includes a first micro-electro-mechanical system (MEMS) sensor die, an integrated circuit (IC) die and a first conductive lid. The first micro-electro-mechanical system (MEMS) sensor die has a first surface and a second surface opposite to the first surface. The IC die is stacked on the first surface of the first MEMS sensor die. The first conductive lid is disposed on the second surface of the first MEMS sensor die.