REDUCTION OF CROSSTALK AND IMPEDANCE SENSITIVITY FOR A MICROSTRIP IN A PRINTED CIRCUIT BOARD OF AN INFORMATION HANDLING SYSTEM

A printed circuit board (PCB), including: a ground reference layer; a pre-impregnated (pre-preg) layer having a surface; a first transmission line positioned on the surface; a second transmission line positioned on the surface spaced-apart from the first transmission line a first distance; and a sol...

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Bibliographische Detailangaben
Hauptverfasser:	Winterberg, Douglas S, Mutnury, Bhyrav M, Kuo, Wan-Ju
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE WAVEGUIDES
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Beschreibung
Zusammenfassung:	A printed circuit board (PCB), including: a ground reference layer; a pre-impregnated (pre-preg) layer having a surface; a first transmission line positioned on the surface; a second transmission line positioned on the surface spaced-apart from the first transmission line a first distance; and a solder mask layer positioned on the surface of the pre-preg layer and surrounding the first transmission line and the second transmission line, the solder mask layer having a thickness and a dielectric constant, wherein the thickness of the solder mask layer and a value of the dielectric constant of the solder mask layer cause convergence of electric fields associated with the first transmission line to be within a second distance from the first transmission line.