LIGHT-EMITTING DIODE PACKAGE STRUCTURE, DISPLAY PANEL AND TILING-TYPE DISPLAY DEVICE

A LED package structure, a display panel and a tiling-type display device are provided. The LED package structure includes a package base, light-emitting units and an encapsulant layer. The package base is disposed with solder pads for bonding with a subsequent driving substrate. The light-emitting units include LED chips. The LED package structure has a first edge and an opposite second edge. A distance from a center point position of the light-emitting unit closest to the first edge among the light-emitting units to the first edge is not equal to a distance from a center point position of the light-emitting unit closest to the second edge among the light-emitting units to the second edge. By way of the design of the LED package structure, an edge of the package structure is retracted inwardly and the position of solder pad is moved inwards to provide sufficient space for border bonding.