SEMICONDUCTOR PACKAGES

In an embodiment, a device includes: an integrated circuit die; a first dielectric layer over the integrated circuit die; a first metallization pattern extending through the first dielectric layer to electrically connect to the integrated circuit die; a second dielectric layer over the first metalli...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chen, Wei-Yu, Huang, Li-Hsien, Su, An-Jhih, Yeh, Ming Shih, Yeh, Der-Chyang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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