COIL COMPONENT

In a coil component, a coil portion includes wiring layers laminated on a substrate. The wiring layers include a first wiring layer wound on a first surface side of the substrate and a second wiring layer wound on a second surface side of the substrate relative to the first wiring layer. At least a...

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Bibliographische Detailangaben
1. Verfasser: AIZAWA, Kiyoshi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In a coil component, a coil portion includes wiring layers laminated on a substrate. The wiring layers include a first wiring layer wound on a first surface side of the substrate and a second wiring layer wound on a second surface side of the substrate relative to the first wiring layer. At least a portion of the second wiring layer is wider than at least a portion of the first wiring layer.