POLISHING PAD WITH IMPROVED WETTABILITY AND METHOD FOR PREPARING SAME

The present invention discloses a polishing pad comprising a laminate composed of a polishing layer, an adhesive layer, and a cushion layer, wherein the cushion layer has a water absorption rate of 100% or less, and a process for manufacturing the polishing pad.

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Bibliographische Detailangaben
Hauptverfasser:	SEO, Jangwon, IM, Chang Gyu, YUN, Sunghoon, YUN, Jong Wook
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention discloses a polishing pad comprising a laminate composed of a polishing layer, an adhesive layer, and a cushion layer, wherein the cushion layer has a water absorption rate of 100% or less, and a process for manufacturing the polishing pad.