HEAT STABLE MULTILAYER BARRIER FILM STRUCTURE

A durable barrier film including a polymeric substrate layer having a thickness between (10) and (100) pm, an inorganic coating layer, and a polymeric buffer layer positioned between the polymeric substrate layer and the inorganic coating layer, the polymeric buffer layer in direct contact with the...

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Bibliographische Detailangaben
Hauptverfasser:	OKLE, Philipp, Christopherson, Roy, Lohwasser, Wolfgang, Ettridge, Peter
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	A durable barrier film including a polymeric substrate layer having a thickness between (10) and (100) pm, an inorganic coating layer, and a polymeric buffer layer positioned between the polymeric substrate layer and the inorganic coating layer, the polymeric buffer layer in direct contact with the inorganic coating layer, wherein the inorganic coating layer comprises a wave structure characterized by an average amplitude between (0.25) and (1.0) pm and a wavelength between (2) and (5) pm.