APPARATUSES AND METHODS FOR MANUFACTURING PACKAGING RECEPTACLES AND RECEPTACLES THEREOF

Embodiments of the present invention disclose packaging receptacles, modular apparatuses for manufacturing such packaging receptacles, and a method thereof. A modular apparatus for manufacturing packaging receptacles includes a paper feeder module, an embossing module, and an adhesive coating module. The paper feeder module includes a plurality of paper feeder rollers configured to feed one or more first layers of paper to the embossing module, and a second layer of paper to the adhesive coating module. The embossing module includes a first embossing roller and a second embossing roller configured to emboss a plurality of impressions onto the one or more first layers, and feed the embossed one or more first layers to the adhesive coating module. Also, the adhesive coating module is configured to apply an adhesive to an outermost surface of the embossed one or more first layers and an inner surface of the second layer.