INJECTION MOLD

The present disclosure relates to an injection mold, a process for using same and a product therefrom. The injection mold can be used for manufacturing an injection-molded product. The injection mold includes: a transfer mold, which is disposed in front of the injection-molded product and forms a pa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIN, Jung Chul, SHIM, Dong Chul, JEONG, Byeong Joon, PARK, Joon Hyoung, KIM, Worl Yong, SHIN, Jae Hyun
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present disclosure relates to an injection mold, a process for using same and a product therefrom. The injection mold can be used for manufacturing an injection-molded product. The injection mold includes: a transfer mold, which is disposed in front of the injection-molded product and forms a pattern on a front surface of the injection-molded product; and a rear surface mold, which is disposed behind the injection-molded product, wherein an embossing pattern is formed on a rear surface part of the rear surface mold, which faces a rear surface of the injection-molded product.