WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

A wiring board includes a substrate, a wiring pattern area arranged on the substrate and including pieces of wiring, and a plurality of dummy pattern areas arranged around the wiring pattern area and electrically independent of the wiring. An aperture ratio of a first dummy pattern area, which is lo...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KAWAGUCHI, Shuji, IIMURA, Keita, SAKAKI, Masashi, KINOSHITA, Kazuki, TAKE, Seiji
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A wiring board includes a substrate, a wiring pattern area arranged on the substrate and including pieces of wiring, and a plurality of dummy pattern areas arranged around the wiring pattern area and electrically independent of the wiring. An aperture ratio of a first dummy pattern area, which is located next to the wiring pattern area, is not lower than an aperture ratio of the wiring pattern area. In addition, an aperture ratio of a second dummy pattern area, which is located next to the first dummy pattern area and farther from the wiring pattern area than the first dummy pattern area is, is higher than the aperture ratio of the first dummy pattern area.