METAL PCB FOR TOPSIDE POWER DELIVERY

METAL PCB FOR TOPSIDE POWER DELIVERY

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JOSEPHSON, Don Douglas, RADHAKRISHNAN, Kaladhar, ARRINGTON, Kyle, SHAN, Bohan, LIU, Kuang, FENG, Hongxia, MOREIN, Stephen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the package substrate adjacent to the die, and a metal printed circuit board (PCB) heat spreader. In an embodiment, a trace on the metal PCB heat spreader couples the die to the voltage regulator.