GLASS BRIDGE FOR CONNECTING DIES

GLASS BRIDGE FOR CONNECTING DIES

An electronic device comprises a substrate including an organic material; a glass bridge die included in the substrate, the glass bridge die including electrically conductive interconnect; and a first integrated circuit (IC) die and at least a second IC die arranged on a surface of the substrate and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Hanna, Carlton, Bacha, Abdallah, Seidemann, Georg, Keser, Lizabeth, De Mesa, Eduardo
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic device comprises a substrate including an organic material; a glass bridge die included in the substrate, the glass bridge die including electrically conductive interconnect; and a first integrated circuit (IC) die and at least a second IC die arranged on a surface of the substrate and including bonding pads connected to the interconnect of the glass bridge die.