ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

An electronic package is provided, in which a first packaging layer is formed on a circuit structure, a portion of at least one conductive column is inserted into the first packaging layer, a remaining portion of the conductive column is protruded from the first packaging layer, and a second packagi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Ke, Chung-Yu, Chen, Liang-Pin
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic package is provided, in which a first packaging layer is formed on a circuit structure, a portion of at least one conductive column is inserted into the first packaging layer, a remaining portion of the conductive column is protruded from the first packaging layer, and a second packaging layer is formed to cover the remaining portion of the conductive column, so that the conductive column is integrally formed in the first packaging layer and the second packaging layer. Therefore, the impact on the conductive column from the second packaging layer can be reduced and the problem of tilting of the conductive column can be prevented.