HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS

HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS

Disclosed herein are microelectronics packages that include thermal pillars for at least localized extraction of generated heat and methods for manufacturing the same. The microelectronics packages may include a substrate and a plurality of dies stacked on the substrate with at least one of the plur...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Javare Gowda, Mohan Prashanth, Wagner, Thomas, Prasad, Vishnu, Proschwitz, Jan, Bacha, Abdallah, Koller, Sonja, Keser, Lizabeth, Waidhas, Bernd, De Mesa, Eduardo
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed herein are microelectronics packages that include thermal pillars for at least localized extraction of generated heat and methods for manufacturing the same. The microelectronics packages may include a substrate and a plurality of dies stacked on the substrate with at least one of the plurality of dies connected to the substrate. A heat spreader may be located proximate at least a portion of the plurality of dies. Respective thermal pillars from a plurality of thermal pillars may extend from at least one of the plurality dies to the heat spreader. Each of the plurality of thermal pillars may define a respective pathway from at least one of the plurality of dies to the heat spreader.