SEMICONDUCTOR DEVICE COMPRISING CONTACT PAD STRUCTURE

SEMICONDUCTOR DEVICE COMPRISING CONTACT PAD STRUCTURE

A semiconductor device is proposed. The semiconductor device includes a contact pad structure over a first surface of a semiconductor body. The semiconductor device further includes a dielectric structure lining a sidewall and a boundary area on a top surface of the contact pad structure, wherein th...

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Bibliographische Detailangaben
Hauptverfasser: ROTH, Roman, SCHOENHERR, Helmut Heinrich, STEINBRENNER, Juergen, HILSENBECK, Jochen, SÖLLRADL, Thomas, GAISBERGER, Richard, OLES, Sophia
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device is proposed. The semiconductor device includes a contact pad structure over a first surface of a semiconductor body. The semiconductor device further includes a dielectric structure lining a sidewall and a boundary area on a top surface of the contact pad structure, wherein the dielectric structure includes a dielectric spacer at the sidewall of the contact pad structure.