MICROBUMP CLUSTER PROBING ARCHITECTURE FOR 2.5D AND 3D DIES

The present disclosure is directed to an inspection tool having a probe head with a probe card with a plurality of probes for performing testing, each of the probes being configured with a first end attached to the probe card and a second end for engaging microbumps coupled to a semiconductor die, t...

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Bibliographische Detailangaben
Hauptverfasser:	CAUGHEY, Ethan, PARKS, JR., Joseph, SHAKYA, Jagat
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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Beschreibung
Zusammenfassung:	The present disclosure is directed to an inspection tool having a probe head with a probe card with a plurality of probes for performing testing, each of the probes being configured with a first end attached to the probe card and a second end for engaging microbumps coupled to a semiconductor die, the plurality of probes including a first set of probes having a first cross-sectional dimension, the first set of probes being arranged in a first set of locations on the probe card, and a second set of probes having a second cross-sectional dimension, the second set of probes being arranged in a second set of locations on the probe card, and a stage for holding the semiconductor die.