COPPER ALLOY PLASTIC WORKING MATERIAL, COPPER ALLOY ROD MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICES, AND TERMINAL

COPPER ALLOY PLASTIC WORKING MATERIAL, COPPER ALLOY ROD MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICES, AND TERMINAL

A copper alloy plastically-worked material comprises Mg in the amount of 10-100 mass ppm and a balance of Cu and inevitable impurities, which comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less...

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Bibliographische Detailangaben
Hauptverfasser: FUKUOKA, Kosei, ITO, Yuki, MAKI, Kazunari, MORIKAWA, Kenji, MATSUNAGA, Hirotaka, FUNAKI, Shinichi, MORI, Hiroyuki
Format: Patent
Sprache:eng
Schlagworte:
ALLOYS
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
CONDUCTORS
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
INSULATORS
METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:A copper alloy plastically-worked material comprises Mg in the amount of 10-100 mass ppm and a balance of Cu and inevitable impurities, which comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less. The electrical conductivity is 97% IACS or greater. The tensile strength is 275 MPa or less. The heat-resistant temperature after draw working is 150° C. or higher.