Thermoset polymers for high temperature applications

Bismaleimide (BMI) and cyanate ester (CE) thermosets were developed for use as high temperature encapsulants and adhesives. These materials must withstand prolonged exposures to large thermal gradients while maintaining good structural integrity, minimal mass losses and outgassing. Bismaleimide and...

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Bibliographische Detailangaben
Hauptverfasser:	Campbell, C. Garrett, Giron, Nicholas Henry, Martinez, Estevan Jose, Celina, Mathias C, Grey, John Kenneth
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP THEIR RELEVANT APPARATUS TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Bismaleimide (BMI) and cyanate ester (CE) thermosets were developed for use as high temperature encapsulants and adhesives. These materials must withstand prolonged exposures to large thermal gradients while maintaining good structural integrity, minimal mass losses and outgassing. Bismaleimide and cyanate ester thermosets exhibit superior thermal performance compared to most epoxies and can often tolerate long exposures to temperatures >200° C. without undergoing significant degradation. In addition to excellent stability at elevated temperatures, uncured resins can have good processing attributes, such as, low viscosities and long working times. In particular, specific combinations of BMI and CE resins can provide significantly better thermal performance than the current standard epoxy system in addition to having excellent processing capabilities.