MULTI-DIMENSIONAL COLUMN-BASED HEAT DISSIPATION FEATURES FOR DATACENTER COOLING SYSTEMS

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a number of multi-dimensional column-based heat dissipation features enable cooling by a cooling media flowing there through so that an individual heat dissipation column having a first dimension and a second dim...

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Bibliographische Detailangaben
Hauptverfasser: Narasimhan, Susheela Nanjunda Rao, Choudhry, Sanjay, Hennigh, Oliver, Tangsali, Kaustubh Mahesh, Nabian, Mohammad Amin
Format: Patent
Sprache:eng
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Zusammenfassung:Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a number of multi-dimensional column-based heat dissipation features enable cooling by a cooling media flowing there through so that an individual heat dissipation column having a first dimension and a second dimension may be supported, with the first dimension being normal relative to an axial flow path of the cooling media, with the second dimension being parallel or offset from parallel relative to the axial flow path and with the second dimension being more than the first dimension.