THERMAL TRANSFER DEVICE FOR ELECTRONIC PROCESSORS

An assembly includes a condenser plate, a plurality of pads and one or more heat-pipes. The condenser plate includes a plurality of apertures. Each of the plurality of apertures overlaps a location of a corresponding one of a plurality of integrated circuits. Each of the plurality of pads is dispose...

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Bibliographische Detailangaben
Hauptverfasser:	Angier, Bradley J, Yang, Tseng-Mau, Zahorsky, Paul Alan, Chen, Waylon Y, Johnson, Karl Yngve
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An assembly includes a condenser plate, a plurality of pads and one or more heat-pipes. The condenser plate includes a plurality of apertures. Each of the plurality of apertures overlaps a location of a corresponding one of a plurality of integrated circuits. Each of the plurality of pads is disposed within each of the plurality of apertures and is configured to move in a vertical direction. The one or more heat-pipes are attached to the condenser plate and the plurality of pads and are configured to move in the vertical direction. Each of the plurality of pads is configured to be in thermal connection with the corresponding one of the plurality of integrated circuits by a movement of the one or more heat-pipes in the vertical direction to transfer to the condenser plate, thermal energy received by each of the plurality of pads from the plurality of integrated circuits.